Hardware Design Engineer (PCB Design)

Hardware Design Engineer (PCB Design)

3 Nos.
147877
Full Time
6.0 Year(s) To 10.0 Year(s)
6.00 LPA TO 10.00 LPA
Engg Design / R&D / Product Mgt
Job Description:

Key Responsibilities
 Design analog, digital, mixed-signal, and power electronic circuits for embedded products.
 Develop complete hardware architecture based on product requirements.
 Design multi-layer PCBs considering signal integrity, EMI/EMC, thermal performance, manufacturability,
and reliability.
 Perform component selection, schematic capture, PCB layout, design verification, and prototype validation.
 Interface with firmware, mechanical, manufacturing, and testing teams throughout the product lifecycle.
 Generate complete hardware documentation including schematics, BOM, Gerber files,
fabrication/assembly drawings, and design reports.
 Coordinate with PCB fabrication and EMS partners during prototype and production stages.
 Perform hardware debugging, root cause analysis, design optimization, and cost reduction.
 Participate in design reviews and mentor junior hardware engineers.
Technical Skills & Expertise
The candidate should have hands-on experience in the following areas:
 Hardware Architecture & Circuit Design – Analog, Digital, Mixed-Signal, Analog Front-End (AFE), Sensor
Interface Design.

 Power Electronics – DC-DC Converters (Buck/Boost/Flyback), LDOs, Battery Chargers, Battery
Management Systems (BMS), Power Distribution.

 PCB Design – Multi-layer (2–8+ layers), HDI, Rigid/Flex/Rigid-Flex PCBs, BGA, Blind/Buried Vias, High-
Density Routing.

 High-Speed PCB Design – Controlled Impedance, DiƯerential Pair Routing, Signal & Power Integrity, DDR,
USB, Ethernet, QSPI.
 RF & Wireless Design – BLE/Wi-Fi Antenna Integration, RF Layout, Matching Networks, EMI Shielding.
 Embedded Interfaces – SPI, I2C, UART, CAN/CAN-FD, RS232/485, USB, Ethernet, GPIO, PWM, ADC/DAC.
 Sensor Integration – Temperature, Pressure, Optical, IMU, Accelerometers, Hall EƯect, Current, Flow and
Position Sensors.
 EMI/EMC Design – Noise Reduction, Grounding, Filtering, ESD & Surge Protection, EMC-Compliant
Hardware Design.
 Design for Manufacturing – DFM, DFA, DFT, Design Reviews, DFMEA Awareness.
 Manufacturing Support – Prototype Bring-up, Vendor Coordination, NPI Support, ECO Management,
Failure Analysis.
 Technical Documentation – Schematics, BOM, Gerber Files, Assembly & Fabrication Drawings, Design
Specifications.
 Hardware Validation & Debugging – Oscilloscope, Logic Analyzer, DMM, Spectrum Analyzer, Network
Analyzer, JTAG Debugging.
 Prototype Development – PCB Assembly, Rework, Functional Testing, Environmental & Reliability Testing.
 Component Engineering – Component Selection, Alternate Qualification, Cost Optimization, Lifecycle &
Obsolescence Management.
 Embedded Platforms – Experience with STM32, NXP, TI, Microchip, Nordic, ESP32, Analog Devices,
Infineon or Renesas-based designs.
 EDA & Simulation Tools – Altium Designer, Cadence Allegro, KiCad, OrCAD, LTspice/PSpice.
Preferred Experience
Candidates with experience in one or more of the following domains will be preferred:
 Industrial Automation
 Embedded Systems
 IoT Products
 Automotive Electronics
 Fuel Dispenser & Energy Systems
 Smart Metering
 Robotics
 Medical Electronics
 Communication Systems

Company Profile

It includes a number of private companies whose activity is focused on the production, marketing, distribution, and technical support of equipment and management systems for the retail areas of the oil industry. 

Equipped with 100% own technology, A Company Group focuses on the production of Fuel Dispensers, Car Wash Equipment, Fleet Management Systems, and Filling Stations, offering a wide range of flexible and custom-made solutions, coupled with its capacity for technological innovation, and design capacity sustain the entire course of the organization. A Company Group also combines its products and technologies with engineering and services solutions dedicated to the optimization of its business model.

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