3 Opening(s)
6.0 Year(s) To 10.0 Year(s)
6.00 LPA TO 10.00 LPA
Key Responsibilities Design analog, digital, mixed-signal, and power electronic circuits for embedded products. Develop complete hardware architecture based on product requirements. Design multi-layer PCBs considering signal integrity, EMI/EMC, thermal performance, manufacturability,and reliability. Perform component selection, schematic capture, PCB layout, design verification, and prototype validation. Interface with firmware, mechanical, manufacturing, and ...
2 Opening(s)
3.0 Year(s) To 10.0 Year(s)
3.00 LPA TO 12.00 LPA
Candidate should have passion to develop the hardware of the Product containing? 32-bit controllers, FPGA, CPLD, Logic chips, Buffer chips, Flash/EEPROM/FRAM chips?Various sensors (e.g. photocoupler, LDR, Magnetic Encoder, Temperature etc.), RFiD tags?Keypad, Relay, Solenoid, various types of LCD (Graphical, 7 segment), Thermal Printer?RS485, I2C, SPI, CAN2.0b, JTAG, USB, Wi-Fi, Ethernet, ...